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Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging
Chiu, Tz-Cheng, Yeh, En-YuVolume:
80
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.11.008
Date:
January, 2018
File:
PDF, 1.54 MB
english, 2018