Volume 80

Microelectronics Reliability

Volume 80

1

High temperature storage reliability of palladium coated copper wire in different EFO current settings

Cheng, Pi-Ying, Lai, Po-Ying, Ye, Jiun-Ming, Chen, Tsung-Chia, Hsieh, Cheng-Li

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.19 MB

english, 2018

2

Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

Kunwar, Anil, Shang, Shengyan, Råback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 3.46 MB

english, 2018

3

Microstructures and properties of Bi 10Ag high temperature solder doped with Cu element

Yin, Limeng, Li, Dong, Yao, Zongxiang, Wang, Gang, Blackburn, Adrian

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.44 MB

english, 2018

4

Threshold voltage peculiarities and bias temperature instabilities of SiC MOSFETs

Aichinger, Thomas, Rescher, Gerald, Pobegen, Gregor

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.68 MB

english, 2018

5

Study of proton radiation effect to row hammer fault in DDR4 SDRAMs

Lim, Chulseung, Park, Kyungbae, Bak, Geunyong, Yun, Donghyuk, Park, Myungsang, Baeg, Sanghyeon, Wen, Shi-Jie, Wong, Richard

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 865 KB

english, 2018

6

Characterization and modeling of dynamic variability induced by BTI in nano-scaled transistors

Garros, Xavier, Laurent, Antoine, Subirats, Alexandre, Federspiel, X., Vincent, E., Reimbold, Gilles

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.74 MB

english, 2018

7

Constitutive modelling on the whole-life uniaxial ratcheting behavior of sintered nano-scale silver paste at room and high temperatures

Chen, Gang, Zhao, Xiaochen

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.04 MB

english, 2018

8

As-grown-generation (AG) model of NBTI: A shift from fitting test data to prediction

Zhang, J.F., Ji, Z., Zhang, W.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 3.95 MB

english, 2018

9

Refined metastability characterization using a time-to-digital converter

Polzer, Thomas, Huemer, Florian, Steininger, Andreas

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 872 KB

english, 2018

10

Design for Small Delay Test - A Simulation Study

Kampmann, Matthias, Hellebrand, Sybille

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.85 MB

english, 2018

11

Experimental study on the influence of junction temperature on the relationship between IGBT switching energy loss and device current

Das, Subhas Chandra, Narayanan, G., Tiwari, Arvind

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 942 KB

english, 2018

12

Modulation method for measuring thermal impedance components of semiconductor devices

Smirnov, V.I., Sergeev, V.A., Gavrikov, A.A., Shorin, A.M.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.74 MB

english, 2018

13

Design for reliability of generic sensor interface circuits

Heinssen, Sascha, Hillebrand, Theodor, Taddiken, Maike, Tscherkaschin, Konstantin, Paul, Steffen, Peters-Drolshagen, Dagmar

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.48 MB

english, 2018

14

Compact modeling of dynamic trap density evolution for predicting circuit-performance aging

Miura-Mattausch, M., Miyamoto, H., Kikuchihara, H., Maiti, T.K., Rohbani, N., Navarro, D., Mattausch, H.J.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.93 MB

english, 2018

15

Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling

Gu, Jian, Lin, Jian, Lei, Yongping, Fu, Hanguang

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 3.31 MB

english, 2018

16

The dominant effect of c -axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints

Tian, Yu, Han, Jing, Ma, Limin, Guo, Fu

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.14 MB

english, 2018

17

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Chiu, Tz-Cheng, Yeh, En-Yu

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.54 MB

english, 2018

18

Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test

Guo, Qiang, Sun, Siyu, Zhang, Zhihao, Chen, Hongtao, Li, Mingyu

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 960 KB

english, 2018

19

Solderless bonding with nanoporous copper as interlayer for high-temperature applications

Sun, Siyu, Guo, Qiang, Chen, Hongtao, Li, Mingyu, Wang, Chunqing

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.66 MB

english, 2018

20

Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events

Wu, Mei-Ling, Lan, Jia-Shen

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.90 MB

english, 2018

21

Estimating dynamic power consumption for memristor-based CiM architecture

Traiola, Marcello, Barbareschi, Mario, Bosio, Alberto

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 853 KB

english, 2018

22

Investigating the impact of the defect dynamic characteristics on the PBTI in the high- κ gate device

Liu, Xianqiang, Xu, Xiaodi, Gu, Chenjie, Gu, Renyuan, Wang, Weiwei, Liu, Wenjun, Duan, Tianli

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 682 KB

english, 2018

23

Ultra-low-voltage boosted driver for self-powered systems

Šovčík, Michal, Kováč, Martin, Arbet, Daniel, Stopjaková, Viera, Potočný, Miroslav

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.69 MB

english, 2018

24

Experimental and modeling study on viscosity of encapsulant for electronic packaging

Shan, Xiuyang, Chen, Yun

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 700 KB

english, 2018

25

VDMOSFET HEF degradation modelling considering turn-around phenomenon

Ye, X.R., Chen, C., Wang, Y.X., Wang, L., Zhai, G.F.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 903 KB

english, 2018

26

Handling of transient and permanent faults in dynamically scheduled super-scalar processors

Mühlbauer, Felix, Schröder, Lukas, Schölzel, Mario

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 720 KB

english, 2018

27

Adaptive accelerated aging for 28 nm HKMG technology

Patra, Devyani, Reza, Ahmed Kamal, Hassan, Mohammed Khaled, Katoozi, Mehdi, Cannon, Ethan H., Roy, Kaushik, Cao, Yu

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 987 KB

english, 2018

28

Non-linear thermal simulation at system level: Compact modelling and experimental validation

Bernardoni, Mirko, Delmonte, Nicola, Chiozzi, Diego, Cova, Paolo

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.32 MB

english, 2018

29

Embedding a feedforward controller into the IGBT gate driver for turn-on transient improvement

Ghorbani, Hamidreza, Caselles, Vicent Sala, Camacho, Alejandro Parades, Martinez, Jose Luis Romeral

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.88 MB

english, 2018

30

Editorial Board

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 37 KB

english, 2018