Investigation of Flip-Chip Bonding for MEMS Applications

Journal of Electronic Packaging 2004 Vol. 126; Iss. 1

Investigation of Flip-Chip Bonding for MEMS Applications

Salalha, W., Zussman, E., Bar-Yoseph, P. Z.
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Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1646427
File:
PDF, 214 KB
english, 2004
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