Viscoelastic Characterization of Low-Dielectric Constant...

Journal of Electronic Packaging 2005 Vol. 127; Iss. 3

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

den Toonder, J. M. J., Ramone, Y., van Dijken, A. R., Beijer, J. G. J., Zhang, G. Q.
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Volume:
127
Year:
2005
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1938990
File:
PDF, 982 KB
english, 2005
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