Prediction of Solder Geometry for an Axisymmetric...

Journal of Electronic Packaging 1997 Vol. 119; Iss. 4

Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

Elkouh, A. F., Ramasubramanian, N., Hsu, T. F., Nigro, N. J., Heinrich, S. M., Lee, P. S., Shangguan, D.
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Volume:
119
Year:
1997
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792248
File:
PDF, 600 KB
english, 1997
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