High-temperature and humidity change the microstructure and...

Microelectronics Reliability 2018 / 04 Vol. 83

High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material

Gain, Asit Kumar, Zhang, Liangchi
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
83
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.02.022
Date:
April, 2018
File:
PDF, 2.04 MB
english, 2018
Conversion to is in progress
Conversion to is failed