Volume 83

Microelectronics Reliability

Volume 83

1

Effects of SiO 2 film thickness and operating temperature on thermally-induced failures in through-silicon-via structures

Han, Chang-Fu, Guo, Yi-Zhe, Chung, Chung-Jen, Shen, Chang-Hong, Lin, Jen-Fin

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.90 MB

english, 2018

2

Fully-differential transimpedance amplifier for reliable wireless communications

Royo, Guillermo, Sánchez-Azqueta, Carlos, Martínez-Pérez, Antonio D., Aldea, Concepción, Celma, Santiago

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 746 KB

english, 2018

3

Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy

Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Råback, Peter, Ma, Haitao, Zhao, Ning

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.07 MB

english, 2018

4

High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material

Gain, Asit Kumar, Zhang, Liangchi

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.04 MB

english, 2018

5

Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis

Favata, Joseph, Shahbazmohamadi, Sina

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.46 MB

english, 2018

6

Simplification of sub-gap density of states extraction method for amorphous In-Ga-Zn-O thin-film transistors by a single capacitance-voltage curve

Wang, Weiliang, Wang, Pengjun, Dai, Mingzhi

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 588 KB

english, 2018

7

Modular fault tolerant processor architecture on a SoC for space

Tabero, Jesús, Regadío, Alberto, Pérez, César, Pazos, Jesús, Reviriego, Pedro, Sánchez-Macian, Alfonso, Maestro, Juan Antonio

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 901 KB

english, 2018

8

Radiation Hardened by Design Latches — A Review and SEU Fault Simulations

Sajjade, Faisal Mustafa, Goyal, Neeraj Kumar, Varaprasad, B.K.S.V.L., Moogina, Ravindra

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.57 MB

english, 2018

9

Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis

Huang, Yongle, Luo, Yifei, Xiao, Fei, Liu, Binli

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.61 MB

english, 2018

10

Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling

Libot, J.B., Alexis, J., Dalverny, O., Arnaud, L., Milesi, P., Dulondel, F.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.08 MB

english, 2018

11

DC-bias-voltage dependence of degradation of aluminum electrolytic capacitors

Hasegawa, K., Tsuzaki, K., Nishizawa, S.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 777 KB

english, 2018

12

A modified two dimensional analytical model for short-channel fully depleted SOI MESFET's

Mohammadi, Hossein, Abdullah, Huda, Dee, Chang Fu, Susthitha Menon, P.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.27 MB

english, 2018

13

A dynamic partial reconfiguration design flow for permanent faults mitigation in FPGAs

Martins, Victor Manuel Gonçalves, Villa, Paulo Ricardo Cechelero, Travessini, Rodrigo, Berejuck, Marcelo Daniel, Bezerra, Eduardo Augusto

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.50 MB

english, 2018

14

Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process

Su, Meiying, Cao, Liqiang, Lin, Tingyu, Chen, Feng, Li, Jun, Chen, Cheng, Tian, Gengxin

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.52 MB

english, 2018

15

A similarity based prognostics approach for real time health management of electronics using impedance analysis and SVM regression

Lee, Changyong, Kwon, Daeil

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.16 MB

english, 2018

16

Low cost sensor network for obstacle avoidance in share-controlled smart wheelchairs under daily scenarios

Pu, Jiangbo, Jiang, Youcong, Xie, Xiaobo, Chen, Xiaogang, Liu, Ming, Xu, Shengpu

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.11 MB

english, 2018

17

A dynamic partial reconfigurable system with combined task allocation method to improve the reliability of FPGA

Wang, Guohua, Liu, Song, Sun, Jiangtao

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.99 MB

english, 2018

18

Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables

Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N., Udrea, F.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.20 MB

english, 2018

19

Acoustic noise and vibration analysis of solid state drive induced by multi-layer ceramic capacitors

Kim, Hyunwoo, Kim, Dongjoon, Park, No-Cheol, Park, Young-Pil

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.61 MB

english, 2018

20

First principles calculations study of crystallographic orientation effects on SiC/Ti and SiC/Cr interfaces

Li, Lei, Jin, Weichao, Yang, Huisheng, Gao, Kewei, Guo, Pengwen, Pang, Xiaolu, Volinsky, Alex A.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 975 KB

english, 2018

21

Editorial: IEDMS 2016

Liu, Chuan-Hsi, Cheng, Chun-Hu, Cheng, Chin-Pao, Liou, Juin J.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 82 KB

english, 2018

22

Scalability comparison between raised- and embedded-SiGe source/drain structures for Si 0.55 Ge 0.45 implant free quantum well pFET

Yamaguchi, S., Witters, L., Mitard, J., Eneman, G., Hellings, G., Hikavyy, A., Loo, R., Horiguchi, N.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.01 MB

english, 2018

23

A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions

Shojaee Nasirabadi, Parizad, Hattel, Jesper Henri

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.34 MB

english, 2018

24

Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue

Dudek, R., Hildebrand, M., Rzepka, S., Fries, T., Döring, R., Seiler, B., Ortmann, R.W.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 5.75 MB

english, 2018

25

Editorial

Ersland, Peter, Menozzi, Roberto

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 86 KB

english, 2018

26

Editorial Board

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 38 KB

english, 2018

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