Realistic non-destructive testing of integrated circuit...

Microelectronics Reliability 2018 / 04 Vol. 83

Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis

Favata, Joseph, Shahbazmohamadi, Sina
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
83
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.02.015
Date:
April, 2018
File:
PDF, 1.46 MB
english, 2018
Conversion to is in progress
Conversion to is failed