Combined simulation and optical measurement technique for...

Microelectronics Reliability 2018 / 04 Vol. 83

Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue

Dudek, R., Hildebrand, M., Rzepka, S., Fries, T., Döring, R., Seiler, B., Ortmann, R.W.
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Volume:
83
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.02.016
Date:
April, 2018
File:
PDF, 5.75 MB
english, 2018
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