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Wafer-Level Vacuum-Packaged Flexible and Bendable Micro Accelerometer
Mahmood, Md. Sohel, Celik-Butler, ZeynepVolume:
18
Language:
english
Journal:
IEEE Sensors Journal
DOI:
10.1109/JSEN.2018.2820023
Date:
May, 2018
File:
PDF, 3.73 MB
english, 2018