Volume 18; Issue 10

IEEE Sensors Journal

Volume 18; Issue 10
3

Wafer-Level Vacuum-Packaged Flexible and Bendable Micro Accelerometer

Year:
2018
Language:
english
File:
PDF, 3.73 MB
english, 2018
8

The Inner Surface Profile Measurement Apparatus for an Electromagnetic Rail-Gun Launcher

Year:
2018
Language:
english
File:
PDF, 1.95 MB
english, 2018
10

IEEE Sensors Journal publication information

Year:
2018
Language:
english
File:
PDF, 99 KB
english, 2018
11

Table of contents

Year:
2018
Language:
english
File:
PDF, 110 KB
english, 2018
12

IEEE Sensor Journal cover/frontispiece competition

Year:
2018
File:
PDF, 927 KB
2018
13

Introducing IEEE Collabratec

Year:
2018
File:
PDF, 2.07 MB
2018
14

IEEE Sensors Council Information

Year:
2018
Language:
english
File:
PDF, 72 KB
english, 2018
15

Front Cover

Year:
2018
File:
PDF, 703 KB
2018