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Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
B. Wunderle, J. Auersperg, V. Großer, E. Kaulfersch, O. Wittler, B. MichelVolume:
10
Language:
english
Pages:
7
DOI:
10.1007/bf02637107
Date:
August, 2004
File:
PDF, 2.09 MB
english, 2004