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Reactive ion etching of copper in an RF N2+ BCl3+ Cl2Plasma
V. G. Mal’shakov, A. E. Berdnikov, A. A. Popov, V. N. GusevVolume:
29
Language:
english
Pages:
6
DOI:
10.1007/bf02773271
Date:
July, 2000
File:
PDF, 424 KB
english, 2000