Phase field simulation of microstructural evolution and...

Microelectronics Reliability 2019 / 01 Vol. 92

Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

Liang, S.B., Ke, C.B., Huang, J.Q., Zhou, M.B., Zhang, X.P.
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Volume:
92
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.11.007
Date:
January, 2019
File:
PDF, 4.27 MB
english, 2019
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