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Volume 92
Main
Microelectronics Reliability
Volume 92
Microelectronics Reliability
Volume 92
1
Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling
Bettahi, Yousra
,
Richard, Caroline
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.63 MB
Your tags:
english, 2019
2
Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient
Liang, S.B.
,
Ke, C.B.
,
Huang, J.Q.
,
Zhou, M.B.
,
Zhang, X.P.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 4.27 MB
Your tags:
english, 2019
3
Study on the destruction mechanism caused by dynamic avalanche in GCTs
Yang, Wuhua
,
Wang, Cailin
,
Yang, Jing
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.95 MB
Your tags:
english, 2019
4
Galvanic corrosion behavior at the Cu-Al ball bond interface: Influence of Pd addition and chloride concentration
Wu, Yuelin
,
Barton, Scott Calabrese
,
Lee, Andre
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.12 MB
Your tags:
english, 2019
5
Power switch failures tolerance of a photovoltaic fed three-level boost DC-DC converter
Oulad-Abbou, Driss
,
Doubabi, Said
,
Rachid, Ahmed
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.96 MB
Your tags:
english, 2019
6
Reliability analysis through linearity and harmonic distortion of a dual-material-gate asymmetric underlapped DGMOSFET
Das, Rahul
,
Dasgupta, Arpan
,
Kundu, Atanu
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.48 MB
Your tags:
english, 2019
7
Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect
Zhu, Ze
,
Chan, Yan-cheong
,
Wu, Fengshun
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.00 MB
Your tags:
english, 2019
8
Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
Herfurth, N.
,
Wu, C.
,
Beyreuther, A.
,
Nakamura, T.
,
De Wolf, I.
,
Simon-Najasek, M.
,
Altmann, F.
,
Croes, K.
,
Boit, C.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.21 MB
Your tags:
english, 2019
9
Online condition monitoring of IGBT modules using current-change rate identification
Mohamed Sathik, M.H.
,
Prasanth, S.
,
Sasongko, F.
,
Pou, J.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.59 MB
Your tags:
english, 2019
10
Over frequency control of photovoltaic inverters in an island microgrid
Hsu, Cheng-Ting
,
Cheng, Tsun-Jen
,
Huang, Hung-Ming
,
Lee, Yih-Der
,
Chang, Yung-Ruei
,
Jiang, Jheng-Lun
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.65 MB
Your tags:
english, 2019
11
Optimization of an Artificial Neural Network System for the Prediction of Failure Analysis Success
Zhao, Lin
,
Goh, S.H.
,
Chan, Y.H.
,
Yeoh, B.L.
,
Hu, Hao
,
Thor, M.H.
,
Tan, Alan
,
Lam, Jeffrey
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.53 MB
Your tags:
english, 2019
12
Metallized film capacitors used for EMI filtering: A reliability review
Valentine, Nathan
,
Azarian, Michael H.
,
Pecht, Michael
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.58 MB
Your tags:
english, 2019
13
On the cumulative distribution function of the defect centric model for BTI reliability
Nouguier, D.
,
Pananakakis, G.
,
Federspiel, X.
,
Rafik, M.
,
Roy, D.
,
Ghibaudo, G.
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 956 KB
Your tags:
2019
14
Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
Oh, Gyung-Hwan
,
Joo, Sung-Jun
,
Jeong, Jae-Woo
,
Kim, Hak-Sung
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.68 MB
Your tags:
english, 2019
15
Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission
Beyreuther, A.
,
Vogt, I.
,
Herfurth, N.
,
Nakamura, T.
,
Fischer, G.G.
,
Motamedi, B.
,
Boit, C.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.88 MB
Your tags:
english, 2019
16
Prognostics of IGBT modules based on the approach of particle filtering
Lu, Yizhou
,
Christou, Aris
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.77 MB
Your tags:
english, 2019
17
High sensitivity detection of ultrasonic signal for nondestructive inspection using pulse compression method
Mitsuta, Hiroki
,
Sakai, Kaoru
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 2.89 MB
Your tags:
2019
18
Resolving trapping effects by scanning microwave microscopy
Hommel, S.
,
Killat, N.
,
Schweinboeck, T.
,
Altes, A.
,
Kreupl, F.
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 1.38 MB
Your tags:
2019
19
High sensitivity detection of ultrasonic signal for nondestructive inspection using pulse compression method
Mitsuta, Hiroki
,
Sakai, Kaoru
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.89 MB
Your tags:
english, 2019
20
Resolving trapping effects by scanning microwave microscopy
Hommel, S.
,
Killat, N.
,
Schweinboeck, T.
,
Altes, A.
,
Kreupl, F.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.38 MB
Your tags:
english, 2019
21
Editorial Board
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 103 KB
Your tags:
2019
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