Volume 92

Microelectronics Reliability

Volume 92

1

Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

Bettahi, Yousra, Richard, Caroline

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.63 MB

english, 2019

2

Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

Liang, S.B., Ke, C.B., Huang, J.Q., Zhou, M.B., Zhang, X.P.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 4.27 MB

english, 2019

3

Study on the destruction mechanism caused by dynamic avalanche in GCTs

Yang, Wuhua, Wang, Cailin, Yang, Jing

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.95 MB

english, 2019

4

Galvanic corrosion behavior at the Cu-Al ball bond interface: Influence of Pd addition and chloride concentration

Wu, Yuelin, Barton, Scott Calabrese, Lee, Andre

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.12 MB

english, 2019

5

Power switch failures tolerance of a photovoltaic fed three-level boost DC-DC converter

Oulad-Abbou, Driss, Doubabi, Said, Rachid, Ahmed

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.96 MB

english, 2019

6

Reliability analysis through linearity and harmonic distortion of a dual-material-gate asymmetric underlapped DGMOSFET

Das, Rahul, Dasgupta, Arpan, Kundu, Atanu

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.48 MB

english, 2019

7

Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

Zhu, Ze, Chan, Yan-cheong, Wu, Fengshun

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.00 MB

english, 2019

8

Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation

Herfurth, N., Wu, C., Beyreuther, A., Nakamura, T., De Wolf, I., Simon-Najasek, M., Altmann, F., Croes, K., Boit, C.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.21 MB

english, 2019

9

Online condition monitoring of IGBT modules using current-change rate identification

Mohamed Sathik, M.H., Prasanth, S., Sasongko, F., Pou, J.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 3.59 MB

english, 2019

10

Over frequency control of photovoltaic inverters in an island microgrid

Hsu, Cheng-Ting, Cheng, Tsun-Jen, Huang, Hung-Ming, Lee, Yih-Der, Chang, Yung-Ruei, Jiang, Jheng-Lun

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 3.65 MB

english, 2019

11

Optimization of an Artificial Neural Network System for the Prediction of Failure Analysis Success

Zhao, Lin, Goh, S.H., Chan, Y.H., Yeoh, B.L., Hu, Hao, Thor, M.H., Tan, Alan, Lam, Jeffrey

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.53 MB

english, 2019

12

Metallized film capacitors used for EMI filtering: A reliability review

Valentine, Nathan, Azarian, Michael H., Pecht, Michael

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.58 MB

english, 2019

13

On the cumulative distribution function of the defect centric model for BTI reliability

Nouguier, D., Pananakakis, G., Federspiel, X., Rafik, M., Roy, D., Ghibaudo, G.

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 956 KB

2019

14

Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface

Oh, Gyung-Hwan, Joo, Sung-Jun, Jeong, Jae-Woo, Kim, Hak-Sung

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 3.68 MB

english, 2019

15

Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission

Beyreuther, A., Vogt, I., Herfurth, N., Nakamura, T., Fischer, G.G., Motamedi, B., Boit, C.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.88 MB

english, 2019

16

Prognostics of IGBT modules based on the approach of particle filtering

Lu, Yizhou, Christou, Aris

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.77 MB

english, 2019

17

High sensitivity detection of ultrasonic signal for nondestructive inspection using pulse compression method

Mitsuta, Hiroki, Sakai, Kaoru

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 2.89 MB

2019

18

Resolving trapping effects by scanning microwave microscopy

Hommel, S., Killat, N., Schweinboeck, T., Altes, A., Kreupl, F.

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 1.38 MB

2019

19

High sensitivity detection of ultrasonic signal for nondestructive inspection using pulse compression method

Mitsuta, Hiroki, Sakai, Kaoru

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.89 MB

english, 2019

20

Resolving trapping effects by scanning microwave microscopy

Hommel, S., Killat, N., Schweinboeck, T., Altes, A., Kreupl, F.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.38 MB

english, 2019

21

Editorial Board

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 103 KB

2019