Non-invasive soft breakdown localisation in low k...

Microelectronics Reliability 2019 / 01 Vol. 92

Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation

Herfurth, N., Wu, C., Beyreuther, A., Nakamura, T., De Wolf, I., Simon-Najasek, M., Altmann, F., Croes, K., Boit, C.
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Volume:
92
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.11.009
Date:
January, 2019
File:
PDF, 2.21 MB
english, 2019
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