Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV)
Liu, Yang, Zhu, Zhangming, Liu, Xiaoxian, Gu, Huaxi, Guo, LixinVolume:
15
Year:
2018
Language:
english
Journal:
IEICE Electronics Express
DOI:
10.1587/elex.15.20180878
File:
PDF, 1.01 MB
english, 2018