Co-MOCVD processed seed layer for through silicon via copper metallization
Esmaeili, Sajjad, Lilienthal, Katharina, Nagy, Nicole, Gerlich, Lukas, Krause, Robert, Uhlig, BenjaminVolume:
211
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2019.03.021
Date:
April, 2019
File:
PDF, 1.16 MB
english, 2019