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Volume 211
Main
Microelectronic Engineering
Volume 211
Microelectronic Engineering
Volume 211
1
Improved digital performance of hybrid CMOS inverter with Si p-MOSFET and InGaAs n-MOSFET in the nanometer regime
De, Suchismita
,
Tewari, Suchismita
,
Biswas, Abhijit
,
Mallik, Abhijit
Journal:
Microelectronic Engineering
Year:
2019
File:
PDF, 2.09 MB
Your tags:
2019
2
Influence of laser power on bonding strength for low purity copper wire bonding technology
Singh, Gurbinder
,
Haseeb, A.S.M.A.
Journal:
Microelectronic Engineering
Year:
2019
Language:
english
File:
PDF, 759 KB
Your tags:
english, 2019
3
Improved digital performance of hybrid CMOS inverter with Si p-MOSFET and InGaAs n-MOSFET in the nanometer regime
De, Suchismita
,
Tewari, Suchismita
,
Biswas, Abhijit
,
Mallik, Abhijit
Journal:
Microelectronic Engineering
Year:
2019
Language:
english
File:
PDF, 2.09 MB
Your tags:
english, 2019
4
Co-MOCVD processed seed layer for through silicon via copper metallization
Esmaeili, Sajjad
,
Lilienthal, Katharina
,
Nagy, Nicole
,
Gerlich, Lukas
,
Krause, Robert
,
Uhlig, Benjamin
Journal:
Microelectronic Engineering
Year:
2019
Language:
english
File:
PDF, 1.16 MB
Your tags:
english, 2019
5
Optical evaluation of nanocomposite metamaterials fabricated by nano-printing technique utilizing silver nanoink
Hokari, Ryohei
,
Kurihara, Kazuma
,
Higurashi, Eiji
,
Hiroshima, Hiroshi
Journal:
Microelectronic Engineering
Year:
2019
Language:
english
File:
PDF, 1.07 MB
Your tags:
english, 2019
6
Editorial Board
Journal:
Microelectronic Engineering
Year:
2019
File:
PDF, 59 KB
Your tags:
2019
1
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