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Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects
Lee, R. T. P., Zuruzi, A. S., Lahiri, S. K.Volume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1604806
File:
PDF, 1.03 MB
english, 2003