Optimum Gullwing Fillet Solder Joint Under Thermomechanical...

Journal of Electronic Packaging 2004 Vol. 126; Iss. 1

Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces

Meekisho, L. L., Nelson-Owusu, K.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1646429
File:
PDF, 508 KB
english, 2004
Conversion to is in progress
Conversion to is failed