Reliability Investigation for Encapsulated Isotropic...

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Chen, Liu Caroline, Lai, Zonghe, Cheng, Zhaonian, Liu, Johan
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Volume:
128
Year:
2006
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2227057
File:
PDF, 658 KB
english, 2006
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