Effect of Electroless Nickel/Displacement Gold Plating...

Journal of Japan Institute of Electronics Packaging 2003 Vol. 6; Iss. 4

Effect of Electroless Nickel/Displacement Gold Plating Process on Strength of Solder Joint

YAMAMOTO, Tomoyuki, WATANABE, Hideto, IZAWA, Kazuhiko, HONMA, Hideo
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Volume:
6
Year:
2003
Language:
english
Journal:
Journal of Japan Institute of Electronics Packaging
DOI:
10.5104/jiep.6.339
File:
PDF, 4.75 MB
english, 2003
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