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Volume 6; Issue 4
Main
Journal of Japan Institute of Electronics Packaging
Volume 6; Issue 4
Journal of Japan Institute of Electronics Packaging
Volume 6; Issue 4
1
Effect of Electroless Nickel/Displacement Gold Plating Process on Strength of Solder Joint
YAMAMOTO, Tomoyuki
,
WATANABE, Hideto
,
IZAWA, Kazuhiko
,
HONMA, Hideo
Journal:
Journal of Japan Institute of Electronics Packaging
Year:
2003
Language:
english
File:
PDF, 4.75 MB
Your tags:
english, 2003
2
Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test
YAGUCHI, Akihiro
,
YAMADA, Munehiro
,
YAMAMOTO, Kenichi
Journal:
Journal of Japan Institute of Electronics Packaging
Year:
2003
File:
PDF, 4.76 MB
Your tags:
2003
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