Fundraising September 15, 2024 – October 1, 2024 About fundraising

Mechanism to improve the reliability of copper wire bonding...

Mechanism to improve the reliability of copper wire bonding with palladium-coating of the wire

Qin, Wentao, Anderson, Tom, Chang, George
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
99
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.04.010
Date:
August, 2019
File:
PDF, 2.61 MB
english, 2019
Conversion to is in progress
Conversion to is failed