Mechanism to improve the reliability of copper wire bonding with palladium-coating of the wire
Qin, Wentao, Anderson, Tom, Chang, GeorgeVolume:
99
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.04.010
Date:
August, 2019
File:
PDF, 2.61 MB
english, 2019