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Volume 99
Main
Microelectronics Reliability
Volume 99
Microelectronics Reliability
Volume 99
1
Sense amplifier offset voltage analysis for both time-zero and time-dependent variability
Agbo, Innocent
,
Taouil, Mottaqiallah
,
Kraak, Daniël
,
Hamdioui, Said
,
Weckx, Pieter
,
Cosemans, Stefan
,
Raghavan, Praveen
,
Catthoor, Francky
,
Dehaene, Wim
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.32 MB
Your tags:
english, 2019
2
Shear strength of off-eutectic Au Ge joints at high-temperature
Larsson, Andreas
,
Tollefsen, Torleif A.
,
Aasmundtveit, Knut E.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 26.70 MB
Your tags:
english, 2019
3
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
Zheng, Zeyang
,
Chiang, Ping-Chen
,
Huang, Yu-Ting
,
Wang, Wei-Ting
,
Li, Po-Chien
,
Tsai, Ya-Hui
,
Chen, Chih-Ming
,
Feng, Shien-Ping
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.90 MB
Your tags:
english, 2019
4
Photovoltaics battery module power supply system with CIGS film applied in portable devices
Liou, Jian-Chiun
,
Yang, Cheng-Fu
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.52 MB
Your tags:
english, 2019
5
Analytical modeling of random discrete traps induced threshold voltage fluctuations in double-gate MOSFET with HfO2/SiO2 gate dielectric stack
S.R., Sriram
,
B., Bindu
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.18 MB
Your tags:
english, 2019
6
Stress investigation of annular-trench-isolated TSV by polarized Raman spectroscopy measurement and finite element simulation
Feng, Wei
,
Watanabe, Naoya
,
Shimamoto, Haruo
,
Aoyagi, Masahiro
,
Kikuchi, Katsuya
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.68 MB
Your tags:
english, 2019
7
Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation
Wu, Yu-Hsien
,
Hung, Fei-Yi
,
Lui, Truan-Sheng
,
Chen, Kuan-Jen
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 4.11 MB
Your tags:
english, 2019
8
Kinematics and reliable analysis of decoupled parallel mechanism for ankle rehabilitation
Chang, Ting-Cheng
,
Zhang, Xiao-Dong
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.19 MB
Your tags:
english, 2019
9
Degradation of AlInAs/InGaAs/InP quantum cascade lasers due to electrode adhesion failure
Pierścińska, D.
,
Pierściński, K.
,
Sobczak, G.
,
Gutowski, P.
,
Płuska, M.
,
Bugajski, M.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.38 MB
Your tags:
english, 2019
10
A no-reference error-tolerability test technique for videos via edge and extreme-value checking and its hardware implementation
Hsieh, Tong-Yu
,
Chan, Shang-En
,
Chen, Chao-Ru
,
Li, Pao-Chien
,
Ho, Chi-Hsuan
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.92 MB
Your tags:
english, 2019
11
Experimental determination of critical adhesion energies with the Advanced Button Shear Test
Pflügler, Nadine
,
Reuther, Georg M.
,
Goroll, Michael
,
Udiljak, Dominik
,
Pufall, Reinhard
,
Wunderle, Bernhard
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.70 MB
Your tags:
english, 2019
12
In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices
Tanner, B.K.
,
Vijayaraghavan, R.K.
,
Roarty, B.
,
Danilewsky, A.N.
,
McNally, P.J.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.65 MB
Your tags:
english, 2019
13
Effect of copper over-pad metallization on reliability of aluminum wire bonds
Kawashiro, Fumiyoshi
,
Takao, Kentaro
,
Kobayashi, Tatsuya
,
Yoshikawa, Masaaki
,
Miyake, Eitaro
,
Endo, Yoshiki
,
Tonedachi, Tatsuo
,
Nishikawa, Hiroshi
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.31 MB
Your tags:
english, 2019
14
Sense amplifier offset voltage analysis for both time-zero and time-dependent variability
Agbo, Innocent
,
Taouil, Mottaqiallah
,
Kraak, Daniël
,
Hamdioui, Said
,
Weckx, Pieter
,
Cosemans, Stefan
,
Raghavan, Praveen
,
Catthoor, Francky
,
Dehaene, Wim
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 2.32 MB
Your tags:
2019
15
Shear strength of off-eutectic Au Ge joints at high-temperature
Larsson, Andreas
,
Tollefsen, Torleif A.
,
Aasmundtveit, Knut E.
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 26.70 MB
Your tags:
2019
16
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
Zheng, Zeyang
,
Chiang, Ping-Chen
,
Huang, Yu-Ting
,
Wang, Wei-Ting
,
Li, Po-Chien
,
Tsai, Ya-Hui
,
Chen, Chih-Ming
,
Feng, Shien-Ping
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 2.90 MB
Your tags:
2019
17
Multi-objective optimal design of motion precision for fork robot arm in LCD panel manufacturing process system
Kuo, Jian-Long
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.42 MB
Your tags:
english, 2019
18
Photovoltaics battery module power supply system with CIGS film applied in portable devices
Liou, Jian-Chiun
,
Yang, Cheng-Fu
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 2.52 MB
Your tags:
2019
19
Mechanism to improve the reliability of copper wire bonding with palladium-coating of the wire
Qin, Wentao
,
Anderson, Tom
,
Chang, George
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.61 MB
Your tags:
english, 2019
20
Stress investigation of annular-trench-isolated TSV by polarized Raman spectroscopy measurement and finite element simulation
Feng, Wei
,
Watanabe, Naoya
,
Shimamoto, Haruo
,
Aoyagi, Masahiro
,
Kikuchi, Katsuya
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 2.68 MB
Your tags:
2019
21
The influence of thermal ageing on the flow-stress of copper traces on PCB's
Yuile, Adam
,
Wiese, Steffen
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.03 MB
Your tags:
english, 2019
22
Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation
Wu, Yu-Hsien
,
Hung, Fei-Yi
,
Lui, Truan-Sheng
,
Chen, Kuan-Jen
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 4.11 MB
Your tags:
2019
23
Kinematics and reliable analysis of decoupled parallel mechanism for ankle rehabilitation
Chang, Ting-Cheng
,
Zhang, Xiao-Dong
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 3.19 MB
Your tags:
2019
24
Numerical simulation of harmful gas distribution in a range hood with an improved flow channel
Wu, Wen-Chung
,
Liou, Jia-You
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 4.12 MB
Your tags:
english, 2019
25
Degradation of AlInAs/InGaAs/InP quantum cascade lasers due to electrode adhesion failure
Pierścińska, D.
,
Pierściński, K.
,
Sobczak, G.
,
Gutowski, P.
,
Płuska, M.
,
Bugajski, M.
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 3.38 MB
Your tags:
2019
26
Modeling and detecting approach for the change point of electronic product infant failure rate
He, Yihai
,
Zhao, Yixiao
,
Wei, Yi
,
Zhang, Anqi
,
Zhou, Di
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 1.26 MB
Your tags:
2019
27
Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds
Chao, Shih-Chieh
,
Huang, Wei-Chen
,
Liu, Jen-Hsiang
,
Song, Jenn-Ming
,
Shen, Po-Yen
,
Huang, Chi-Lin
,
Hung, Lung-Tang
,
Chang, Chin-Huang
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 2.92 MB
Your tags:
english, 2019
28
Life cycle trends of electronic materials, processes and components
Huang, Chien-Ming
,
Romero, Jose A.
,
Osterman, Michael
,
Das, Diganta
,
Pecht, Michael
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.07 MB
Your tags:
english, 2019
29
Reliability analysis of complex brain networks based on chaotic time series
Sun, Gengxin
,
Bin, Sheng
,
Chen, Chi-Cheng
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.37 MB
Your tags:
english, 2019
30
Multi-objective optimal design of motion precision for fork robot arm in LCD panel manufacturing process system
Kuo, Jian-Long
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 3.42 MB
Your tags:
2019
31
CIRCA: Towards a modular and extensible framework for approximate circuit generation
Witschen, Linus
,
Awais, Muhammad
,
Ghasemzadeh Mohammadi, Hassan
,
Wiersema, Tobias
,
Platzner, Marco
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 5.54 MB
Your tags:
english, 2019
32
Failure analysis and process improvement of copper diffusion
Yuan, Luyue
,
Xia, Zhiliang
,
Hu, Xiaolong
,
Liu, Jun
,
Huo, Zongliang
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.12 MB
Your tags:
english, 2019
33
Numerical simulation of harmful gas distribution in a range hood with an improved flow channel
Wu, Wen-Chung
,
Liou, Jia-You
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 4.12 MB
Your tags:
2019
34
Review of shelf life evaluation methods and a physics of failure approach for shelf life estimation for electronic components
Li, Nga Man Jennifa
,
Das, Diganta
,
McCluskey, Patrick
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 612 KB
Your tags:
english, 2019
35
Editorial Board
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 40 KB
Your tags:
2019
1
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