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Failure analysis and process improvement of copper diffusion
Yuan, Luyue, Xia, Zhiliang, Hu, Xiaolong, Liu, Jun, Huo, ZongliangVolume:
99
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.04.006
Date:
August, 2019
File:
PDF, 1.12 MB
english, 2019