Modular parametric finite element modelling for...

Microsystem Technologies 2004 / 08 Vol. 10; Iss. 5

Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

B. Wunderle, J. Auersperg, V. Großer, E. Kaulfersch, O. Wittler, B. Michel
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Volume:
10
Language:
english
Pages:
7
DOI:
10.1007/s00542-004-0426-z
Date:
August, 2004
File:
PDF, 1.03 MB
english, 2004
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