Collapse-free thermal bonding technique for large area...

Microsystem Technologies 2008 / 02 Vol. 14; Iss. 2

Collapse-free thermal bonding technique for large area microchambers in plastic lab-on-a-chip applications

Dong Sung Kim, Hyun Sup Lee, Jungyoup Han, Se Hwan Lee, Chong H. Ahn, Tai Hun Kwon
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Volume:
14
Language:
english
Pages:
6
DOI:
10.1007/s00542-007-0416-z
Date:
February, 2008
File:
PDF, 443 KB
english, 2008
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