Wafer-level plasma activated bonding: new technology for MEMS fabrication
Viorel Dragoi, Gerald Mittendorfer, Christine Thanner, Paul LindnerVolume:
14
Language:
english
Pages:
7
DOI:
10.1007/s00542-007-0437-7
Date:
April, 2008
File:
PDF, 298 KB
english, 2008