Shallow and deep dry etching of silicon using ICP cryogenic...

Microsystem Technologies 2010 / 05 Vol. 16; Iss. 5

Shallow and deep dry etching of silicon using ICP cryogenic reactive ion etching process

Ü. Sökmen, A. Stranz, S. Fündling, S. Merzsch, R. Neumann, H.-H. Wehmann, E. Peiner, A. Waag
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
16
Language:
english
Pages:
8
DOI:
10.1007/s00542-010-1035-7
Date:
May, 2010
File:
PDF, 969 KB
english, 2010
Conversion to is in progress
Conversion to is failed