Flip chip packaging for MEMS microphones

Microsystem Technologies 2010 / 05 Vol. 16; Iss. 5

Flip chip packaging for MEMS microphones

Gregor Feiertag, Matthias Winter, Anton Leidl
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Volume:
16
Language:
english
Pages:
7
DOI:
10.1007/s00542-010-1039-3
Date:
May, 2010
File:
PDF, 423 KB
english, 2010
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