COOL PLASMA ACTIVATED SURFACE IN SILICON WAFER DIRECT...

COOL PLASMA ACTIVATED SURFACE IN SILICON WAFER DIRECT BONDING TECHNOLOGY

SUN, G.-L., ZHAN, J., TONG, Q.-Y., XIE, S.-J., CAI, Y.-M., LU, S.-J.
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Volume:
49
Journal:
Le Journal de Physique Colloques
DOI:
10.1051/jphyscol:1988416
Date:
September, 1988
File:
PDF, 1.79 MB
1988
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