Improvement in Adhesion of Copper Plating on Resin...

Improvement in Adhesion of Copper Plating on Resin Substrate Using Chemically Adsorbed Monolayer Containing Pyrrolyl Group and Polypyrrole Film

Ohkubo, Yuji, Onishi, Shogo, Ogawa, Kazufumi
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Volume:
14
Year:
2011
Journal:
Journal of Japan Institute of Electronics Packaging
DOI:
10.5104/jiep.14.121
File:
PDF, 1.39 MB
2011
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