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Improvement in Adhesion of Copper Plating on Resin Substrate Using Chemically Adsorbed Monolayer Containing Pyrrolyl Group and Polypyrrole Film
Ohkubo, Yuji, Onishi, Shogo, Ogawa, KazufumiVolume:
14
Year:
2011
Journal:
Journal of Japan Institute of Electronics Packaging
DOI:
10.5104/jiep.14.121
File:
PDF, 1.39 MB
2011