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Volume 14; Issue 2
Main
Journal of Japan Institute of Electronics Packaging
Volume 14; Issue 2
Journal of Japan Institute of Electronics Packaging
Volume 14; Issue 2
1
Improvement in Adhesion of Copper Plating on Resin Substrate Using Chemically Adsorbed Monolayer Containing Pyrrolyl Group and Polypyrrole Film
Ohkubo, Yuji
,
Onishi, Shogo
,
Ogawa, Kazufumi
Journal:
Journal of Japan Institute of Electronics Packaging
Year:
2011
File:
PDF, 1.39 MB
Your tags:
2011
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