Electromigration Study of Cu Dual-damascene Interconnects...

Electromigration Study of Cu Dual-damascene Interconnects with a CVD MSQ Low k Dielectric

Lu, Xia, Lee, Ki-Don, Yoon, Sean, Matsuhashi, Hideki, Lu, Michael, Zhang, Kai, Ho, Paul S.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
766
Year:
2003
Journal:
MRS Proceedings
DOI:
10.1557/PROC-766-E1.9
File:
PDF, 674 KB
2003
Conversion to is in progress
Conversion to is failed