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Electromigration Study of Cu Dual-damascene Interconnects with a CVD MSQ Low k Dielectric
Lu, Xia, Lee, Ki-Don, Yoon, Sean, Matsuhashi, Hideki, Lu, Michael, Zhang, Kai, Ho, Paul S.Volume:
766
Year:
2003
Journal:
MRS Proceedings
DOI:
10.1557/PROC-766-E1.9
File:
PDF, 674 KB
2003