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Volume 766

MRS Proceedings

Volume 766

1

Reduced Time for Uniform Etching of Cu Power Planes during FIB Editing

Makarov, V.V., Thompson, W.B., Lundquist, T.R.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 2.08 MB

english, 2003

2

Detection of Voids in Tungsten Interconnect Vias Using Laser-Induced Surface Acoustic Waves

Tower, Joshua, Gostein, Michael, Otsubo, Koichi, Kawasaki, Atsushi

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 476 KB

english, 2003

3

Effect of Plasma Pre-Treatment on Dewetting Properties of CVD Cu on CVDW2N Barrier Layer

Cheng, Degang, Nuesca, Guillermo, Eisenbraun, Eric

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 231 KB

english, 2003

4

Development and Application of On-Wafer Small Angle X-Rayscattering for the Quantification of Pore Morphology in Low Kporous Silk Semiconductor Dielectrics

Landes, Brian, Kern, Brandon, Stokich, Ted, Niu, Jason, Yontz, Dorie, Radler-Carol, Mike, Ouellette, Mohler Kacee, Lucero, Sebring, Hahnfeld, Jerry, King, Danny, Quintana, John, Weigand, Steve

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 448 KB

english, 2003

5

Environmental Effects on Subcritical Delamination of Dielectric and Metal Films from Organosilicate Glass (OSG) Thin Films

Lin, Y., Vlassak, J.J., Tsui, T.Y., McKerrow, A.J.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 153 KB

english, 2003

6

Wafer Thinning for Monolithic 3D Integration

Jindal, A., Lu, J.Q., Kwon, Y., Rajagopalan, G., McMahon, J.J., Zeng, A.Y., Flesher, H.K., Cale, T.S., Gutmann, R.J.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 442 KB

english, 2003

7

Wafer Thinning for Monolithic 3D Integration

Jindal, A., Lu, J.Q., Kwon, Y., Rajagopalan, G., McMahon, J.J., Zeng, A.Y., Flesher, H.K., Cale, T.S., Gutmann, R.J.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 442 KB

2003

8

Electrical, Mechanical, and Structural Properties of Fluoro-Containing Poly(silsesquioxanes) Based Porous Low k Thin Films

Hyeon-Lee, Jingyu, Rhee, Jihoon, Kim, Jungbae, Yim, Jin-Heong, Chang, Seok

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 110 KB

english, 2003

9

Deposition and Characteristics of Tantalum Nitride films by Plasma Assisted Atomic Layer Deposition as Cu Diffusion Barrier

Na, Kyoung-Il, Park, Se-Jong, Jeong, Woo-Cheol, Kim, Se-Hoon, Boo, Sung-Eun, Bae, Nam-Jin, Lee, Jung-Hee

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 358 KB

english, 2003

10

The Study of Modified Layers in SiCOH Dielectrics using Spectroscopic Ellipsometry

Worsley, Marcus A., Bent, Stacey F., Gates, Stephen M., Kumar, Kaushik, Dalton, Timothy, Hedrick, Jeffrey C.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 145 KB

english, 2003

11

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhögl, W., Traving, M., Hönlein, W., Bertagnolli, E.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 1.00 MB

english, 2003

12

Indentation Fracture Toughness Measurements of Low Dielectric Constant Materials

Morris, Dylan J., Cook, Robert F.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 706 KB

english, 2003

13

Electrical, Mechanical, and Structural Properties of Fluoro-Containing Poly(silsesquioxanes) Based Porous Low k Thin Films

Hyeon-Lee, Jingyu, Rhee, Jihoon, Kim, Jungbae, Yim, Jin-Heong, Chang, Seok

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 110 KB

2003

14

Deposition and Characteristics of Tantalum Nitride films by Plasma Assisted Atomic Layer Deposition as Cu Diffusion Barrier

Na, Kyoung-Il, Park, Se-Jong, Jeong, Woo-Cheol, Kim, Se-Hoon, Boo, Sung-Eun, Bae, Nam-Jin, Lee, Jung-Hee

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 358 KB

2003

15

The Study of Modified Layers in SiCOH Dielectrics using Spectroscopic Ellipsometry

Worsley, Marcus A., Bent, Stacey F., Gates, Stephen M., Kumar, Kaushik, Dalton, Timothy, Hedrick, Jeffrey C.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 145 KB

2003

16

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhögl, W., Traving, M., Hönlein, W., Bertagnolli, E.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 1.00 MB

2003

17

Indentation Fracture Toughness Measurements of Low Dielectric Constant Materials

Morris, Dylan J., Cook, Robert F.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 706 KB

2003

18

Characterization of Electroplated Copper Films with Laser-Generated Surface Acoustic Waves

Maznev, A.A., Gostein, M., Brongersma, S.H.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 848 KB

2003

19

Supercritical Carbon Dioxide-based Fluids Used as a Recovery Tool for Low-k Materials

Orozco-Teran, Rosa A., Gorman, Brian P., Zhang, Zhengping, Mueller, Dennis W., Reidy, Richard F.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 377 KB

english, 2003

20

Structure and Properties of Polysilsesquioxanes and Copolymers for Ultra-Low Dielectric Films

Yoon, Do Y., Ro, Hyun Wook, Park, Eun Su, Lee, Jin-Kyu, Kim, Hie-Joon, Char, Kookheon, Rhee, Hee-Woo, Kwon, Dongil, Gidley, David W.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 229 KB

english, 2003

21

Vapor Treatment of Copper Surface Using Organic Acids

Ishikawa, Kenji, Yagishita, Teruo, Nakamura, Moritaka

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 228 KB

english, 2003

22

Properties and Barrier Material Interactions of Electroless Copper used for Seed Enhancement

Witt, C., Pfeifer, K.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 1.24 MB

english, 2003

23

Plasma Hydrogenation – A New Method of Reducing the k Value of the Low k Polyimide Film

Kuo, Yue, Chung, Taewoo, Nominanda, Helinda

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 207 KB

english, 2003

24

Silicides for the 65 nm Technology Node

Besser, Paul R., Chan, Simon, Paton, Eric, Kammler, Thorsten, Brown, David, King, Paul, Pressley, Laura

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 1.77 MB

2003

25

Characterization of Atomic Layer DepositedWN x C y Thin Film as a Diffusion Barrier for CopperMetallization

Kim, Soo-Hyun, Oh, Su Suk, Kim, Hyun-Mi, Kang, Dae-Hwan, Kim, Ki-Bum, Li, Wei-Min, Haukka, Suvi, Tuominen, Marko

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 1.63 MB

english, 2003

26

A Novel Technique to Re-construct 3D Void in Passivated Metal Interconnects

Tan, Cher Ming, Gan, Zhenghao, Zhang, Guan, Prasad, Krishnamachar, Zhang, Dao Hua

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 170 KB

english, 2003

27

The characterization and preparation of porous low dielectric films using various cyclodextrins as template materials

Yim, Jin-Heong, Kim, Jung-Bae, Jeong, Hyun-Dam, Lyu, Yi-Yeoul, Mah, Sang Kook, Hyeon-Lee, Jingyu, Lee, Kwang Hee, Chang, Seok, Pu, Lyong Sun, Hu, Y. F., Sun, J.N., Gidley, D.W.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 371 KB

english, 2003

28

Solvent diffusion in porous low- k dielectric films

Shamiryan, Denis, Maex, Karen

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 115 KB

2003

29

Using multi-dimensional contact mechanics experiments to measure Poisson's ratio of porous low-k films

Lucas, B. N., Hay, J. C., Oliver, W. C.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 198 KB

2003

30

Quantitative Measurements of Subcritical Debonding of Cu Films from Glass Substrates

Pang, M., Baker, S.P.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 99 KB

2003

31

Observation of Grain Growth in Cu Films by In-Situ EBSD Analysis

Field, D.P., Nowell, M.M., Kononenko, O.V.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 760 KB

2003

32

Electromigration Study of Cu Dual-damascene Interconnects with a CVD MSQ Low k Dielectric

Lu, Xia, Lee, Ki-Don, Yoon, Sean, Matsuhashi, Hideki, Lu, Michael, Zhang, Kai, Ho, Paul S.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 674 KB

2003

33

Optimized Materials Properties for Organosilicate Glasses Produced by Plasma-Enhanced Chemical Vapor Deposition

O'Neill, M.L., Vrtis, R.N., Vincent, J.L., Lukas, A.S., Karwacki, E.J., Peterson, B.K., Bitner, M.D.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 208 KB

2003

34

Effect of barrier layers on the texture and microstructure of Copper films

Muppidi, Tejodher, Field, David P

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 1.28 MB

2003