Effect of adhesive force on underfill process based on...

Microelectronics International 2020 / 01 Vol. 37; Iss. 1

Effect of adhesive force on underfill process based on lattice Boltzmann method

Ishak, M.H.H., Ismail, Farzad, Abdul Aziz, Mohd Sharizal, Abdullah, M.Z.
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Volume:
37
Journal:
Microelectronics International
DOI:
10.1108/mi-11-2018-0071
Date:
January, 2020
File:
PDF, 2.18 MB
2020
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