Volume 37; Issue 1

Microelectronics International

Volume 37; Issue 1

1

Intermetallic growth kinetics in gold ball bonds on Al-1%Si-0.5%Cu bond pads at 175 â C

Breach, Christopher

Journal:

Microelectronics International

Year:

2019

File:

PDF, 2.15 MB

2019

2

Design, fabrication and characterization of LTCC micro-hotplates for gas-sensing application

Kulhari, Lokesh, Chandran, Achu, Ray, Kanad, Khanna, P.K.

Journal:

Microelectronics International

Year:

2019

File:

PDF, 1.14 MB

2019

3

Design of microfluidic experimental setup for the detection of heavy metal ions using piezoresistive BioMEMS sensor

Rotake, Dinesh Ramkrushna, Darji, Anand D., Kale, Nitin S.

Journal:

Microelectronics International

Year:

2019

File:

PDF, 6.96 MB

2019

4

Crystal orientation dependence of alternating current photo-assisted (ACPEC) porous silicon for potential optoelectronic application

Abd Rahim, Alhan Farhanah, Mustakim, Aida Azrenda, Mohd Razali, Nurul Syuhadah, Mahmood, Ainorkhilah, Radzali, Rosfariza, Zoolfakar, Ahmad Sabirin, Mohd Ali, Yusnita

Journal:

Microelectronics International

Year:

2019

File:

PDF, 1.45 MB

2019

5

Implementation of phosphor sedimentation to reduce thermal instability issue affecting white LED luminescence

Peng, Hui Yuen, Yam, Fong Kwong

Journal:

Microelectronics International

Year:

2019

File:

PDF, 1.59 MB

2019

6

Effect of adhesive force on underfill process based on lattice Boltzmann method

Ishak, M.H.H., Ismail, Farzad, Abdul Aziz, Mohd Sharizal, Abdullah, M.Z.

Journal:

Microelectronics International

Year:

2020

File:

PDF, 2.18 MB

2020