The interfacial reaction and microstructure of Co/In/Cu...

Microelectronics Reliability 2020 / 10 Vol. 113

The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering

Liu, Zhi-Quan, Meng, Zhi-Chao, Wu, Di, Shang, Zhengang, He, Xin, Xiong, Xiaodong
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Volume:
113
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113906
Date:
October, 2020
File:
PDF, 1.61 MB
2020
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