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Volume 113
Main
Microelectronics Reliability
Volume 113
Microelectronics Reliability
Volume 113
1
Editorial Board
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 35 KB
Your tags:
2020
2
Analytical model for total ionizing dose-induced excess base current in PNP BJTs
Li, L.
,
Chen, X.C.
,
Li, X.J.
,
Li, Z.H.
,
Jian, Y.
,
Wu, Y.Z.
,
Zhang, J.P.
,
Ren, M.
,
Zhang, B.
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 3.29 MB
Your tags:
2020
3
Temperature dependence of bipolar junction transistor current-voltage characteristics after low dose rate irradiation
Privat, A.
,
Barnaby, H.J.
,
Tolleson, B.S.
,
Muthuseenu, K.
,
Adell, P.C.
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 2.96 MB
Your tags:
2020
4
Bias stress instability of LTPS TFTs on flexible substrate with activation annealing temperature
Kim, Soonkon
,
Kim, Hyojung
,
Kim, Kihwan
,
Choi, Pyungho
,
Choi, Byoungdeog
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 3.42 MB
Your tags:
2020
5
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy
Tikale, Sanjay
,
Prabhu, K. Narayan
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 12.73 MB
Your tags:
2020
6
Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments
Ross, Nick
,
Asokan, Muthappan
,
Ashok Kumar, Goutham Issac
,
Caperton, Joshua
,
Alptekin, John
,
Salunke, Ashish Shivaji
,
Chyan, Oliver M.
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 2.79 MB
Your tags:
2020
7
Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field
Hammad, A.E.
,
Ragab, M.
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 8.00 MB
Your tags:
2020
8
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering
Liu, Zhi-Quan
,
Meng, Zhi-Chao
,
Wu, Di
,
Shang, Zhengang
,
He, Xin
,
Xiong, Xiaodong
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 1.61 MB
Your tags:
2020
9
Correlation between OCVD carrier lifetime vs temperature measurements and reverse recovery behavior of the body diode of SiC power MOSFETs
Sapienza, S.
,
Sozzi, G.
,
Santoro, D.
,
Cova, P.
,
Delmonte, N.
,
Verrini, G.
,
Chiorboli, G.
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 329 KB
Your tags:
2020
10
Bending reliability of NiâMWCNT composite solder with a differential structure
Lee, Choong-Jae
,
Hwang, Byeong-Uk
,
Min, Kyung Deuk
,
Kim, Jae-Ha
,
Jung, Seung-Boo
Journal:
Microelectronics Reliability
Year:
2020
File:
PDF, 7.95 MB
Your tags:
2020
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