Wafer bonding: Investigation and in situ observation of the...

Sensors and Actuators A: Physical 1990 Vol. 23; Iss. 1-3

Wafer bonding: Investigation and in situ observation of the bond process

Christine Harendt, Heinz-Gerd Graf, Elisabeth Penteker, Bernd Höfflinger
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Volume:
23
Year:
1990
Language:
english
Pages:
4
DOI:
10.1016/0924-4247(90)87061-m
File:
PDF, 966 KB
english, 1990
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