Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis
Tong Yan Tee, Zhaowei ZhongVolume:
44
Year:
2004
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2003.07.004
File:
PDF, 448 KB
english, 2004