Volume 44; Issue 1

Microelectronics Reliability

Volume 44; Issue 1

1

Fatigue analysis of high-speed photodiode submodule by using FEM

K.S. Kim, H.I. Kim, C.H. Yu, E.G. Chang

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 393 KB

english, 2004

2

Electron transport through broken down ultra-thin SiO2 layers in MOS devices

Enrique Miranda, Jordi Suñé

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 599 KB

english, 2004

3

Thermal distribution calculations for block level placement in embedded systems

Rajendra M. Patrikar, K. Murali, Li Er Ping

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 366 KB

english, 2004

4

Hole injection enhanced hot-carrier degradation in PMOSFETs used for systems on chip applications with 6.5–2 nm thick gate-oxides

A. Bravaix, D. Goguenheim, N. Revil, E. Vincent

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 467 KB

english, 2004

5

A review of electrostatic discharge (ESD) in advanced semiconductor technology

Steven H. Voldman

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 639 KB

english, 2004

6

The effect of model building on the accuracy of fatigue life predictions in electronic packages

P. Towashiraporn, G. Subbarayan, B. McIlvanie, B.C. Hunter, D. Love, B. Sullivan

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 792 KB

english, 2004

7

Thermosonic flip-chip bonding for SAW filter

Taizo Tomioka, Tomohiro Iguchi, Ikuo Mori

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 410 KB

english, 2004

8

Influence of mobility model on extraction of stress dependent source–drain series resistance

M.M. De Souza, S.K. Manhas, D. Chandra Sekhar, A.S. Oates, P. Chaparala

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 427 KB

english, 2004

9

System on chip design languages; Anne Mignotte, Eugenio Villar, Lynn Horobin, editors, Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 283, plus IX, 141 €. ISBN 1-4020-7046-2

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 198 KB

english, 2004

10

Applications of temperature phase measurements to IC testing

J. Altet, J.M. Rampnoux, J.C. Batsale, S. Dilhaire, A. Rubio, W. Claeys, S. Grauby

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 694 KB

english, 2004

11

Effects of electrical stress on mid-gap interface trap density and capture cross sections in n-MOSFETs characterized by pulsed interface probing measurements

Hyuck In Kwon, In Man Kang, Byung-Gook Park, Jong Duk Lee, Sang Sik Park, Jung Chak Ahn, Yong Hee Lee

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 276 KB

english, 2004

12

New distributed model of NPT IGBT dedicated to power circuits design

G. Bonnet, P. Austin, J.L. Sanchez

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 510 KB

english, 2004

13

Flip-chip packaging solution for CMOS image sensor device

Jong-heon Kim, In-Soo Kang, Chi-jung Song, Young-Jik Hur, Hak-Nam Kim, Esdy Baek, Tae-Jun Seo

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 592 KB

english, 2004

14

Origin of 1/f noise in lateral PNP bipolar transistors

Enhai Zhao, Zeynep Çelik-Butler, Frank Thiel, Ranadeep Dutta

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 332 KB

english, 2004

15

Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 495 KB

english, 2004

16

Implementation of self-checking two-level combinational logic on FPGA and CPLD circuits

Mile K Stojčev, Goran Lj Djordjević, Tatjana R Stanković

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 257 KB

english, 2004

17

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Tong Yan Tee, Zhaowei Zhong

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 448 KB

english, 2004

18

Design and simulation of micromechanical thermal converter for RF power sensor microsystem

Jiri Jakovenko, Miroslav Husak, Tibor Lalinsky

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 532 KB

english, 2004

19

Design criteria for low distortion in feedback OPAMP circuits; Bjornar Hernes, Trond Saether, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 160, plus XXV, 110 €. ISBN 1-4020-7356-9

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 200 KB

english, 2004

20

Simulation of partially and near fully depleted SOI MOSFET devices and circuits using SPICE compatible physical subcircuit model

Mohamed A. Imam, Mohamed A. Osman, Ashraf A. Osman

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 429 KB

english, 2004

21

Single-equation model for low and high voltage soft breakdown conduction

E. Miranda, E. Mallaina

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 281 KB

english, 2004

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