Flip chip attachment on flexible LCP substrate using an ACF

Microelectronics Reliability 2005 Vol. 45; Iss. 3-4

Flip chip attachment on flexible LCP substrate using an ACF

L. Frisk, E. Ristolainen
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Volume:
45
Year:
2005
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2004.10.009
File:
PDF, 308 KB
english, 2005
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