Test structure assembly for bump bond yield measurement on...

Microelectronics Reliability 2006 Vol. 46; Iss. 7

Test structure assembly for bump bond yield measurement on high density flip chip technologies

M. Ullán, M. Lozano, M. Chmeissani, G. Blanchot, E. Cabruja, J. García, M. Maiorino, R. Martínez, G. Pellegrini, C. Puigdengoles
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Volume:
46
Year:
2006
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2005.10.001
File:
PDF, 324 KB
english, 2006
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