Pb-free high temperature solders for power device packaging

Microelectronics Reliability 2006 Vol. 46; Iss. 9-11

Pb-free high temperature solders for power device packaging

Y. Yamada, Y. Takaku, Y. Yagi, Y. Nishibe, I. Ohnuma, Y. Sutou, R. Kainuma, K. Ishida
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Volume:
46
Year:
2006
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2006.07.083
File:
PDF, 989 KB
english, 2006
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