Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application
J.S. Hwang, M.J. Yim, K.W. PaikVolume:
48
Year:
2008
Language:
english
Pages:
7
DOI:
10.1016/j.microrel.2006.07.097
File:
PDF, 391 KB
english, 2008