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Volume 48; Issue 2
Main
Microelectronics Reliability
Volume 48; Issue 2
Microelectronics Reliability
Volume 48; Issue 2
1
Bert Haskell, ,Portable Electronics Product Design and Development (2004) McGraw Hill,New York 0-07-141639-0 Hardcover, pp. 372, plus XII.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 62 KB
Your tags:
english, 2008
2
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
L. Valdevit
,
V. Khanna
,
A. Sharma
,
S. Sri-Jayantha
,
D. Questad
,
K. Sikka
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 2.47 MB
Your tags:
english, 2008
3
Digital image correlation for solder joint fatigue reliability in microelectronics packages
Yaofeng Sun
,
John H.L. Pang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 2.46 MB
Your tags:
english, 2008
4
Improved performances of a two-step passivated heterojunction bipolar transistor
Shiou-Ying Cheng
,
Ssu-I Fu
,
Kuei-Yi Chu
,
Tzu-Pin Chen
,
Wen-Chau Liu
,
Li-Yang Chen
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 170 KB
Your tags:
english, 2008
5
Thermal stress concentration factors for defects in plated-through-vias
O. Belashov
,
J.K. Spelt
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 764 KB
Your tags:
english, 2008
6
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops
Chang-Lin Yeh
,
Yi-Shao Lai
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.30 MB
Your tags:
english, 2008
7
Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
Ravi Kandasamy
,
A.S. Mujumdar
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.60 MB
Your tags:
english, 2008
8
Electrical stress effect on RF power characteristics of SiGe hetero-junction bipolar transistors
Sheng-Yi Huang
,
Kun-Ming Chen
,
Guo-Wei Huang
,
Cheng-Chou Hung
,
Wen-Shiang Liao
,
Chun-Yen Chang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 997 KB
Your tags:
english, 2008
9
Shuvra S. Bhattacharyya, E.F. Deprettere, Jurgen Teich, (Eds.), Domain-Specific Processors: Systems, Architectures, Modeling, and Simulation, Hardcover, pp. 261, plus XV, Marcel Dekker, Inc., New York, 2004, ISBN 0-8427-4711-9
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 67 KB
Your tags:
english, 2008
10
Sajjan G. Shiva, ,Advanced Computer Architectures (2006) CRC Press, Francis & Taylor Group,Boca Raton 0-8493-3758-5 Hardcover. p. 335, plus XIV.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 63 KB
Your tags:
english, 2008
11
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application
J.S. Hwang
,
M.J. Yim
,
K.W. Paik
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 391 KB
Your tags:
english, 2008
12
Influence of sidewall spacer on threshold voltage of MOSFET with high-k gate dielectric
J.P. Xu
,
F. Ji
,
P.T. Lai
,
J.G. Guan
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 205 KB
Your tags:
english, 2008
13
Effects of different drop test conditions on board-level reliability of chip-scale packages
Yi-Shao Lai
,
Po-Chuan Yang
,
Chang-Lin Yeh
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.30 MB
Your tags:
english, 2008
14
Error propagation analysis using FPGA-based SEU-fault injection
Alireza Ejlali
,
Seyed Ghassem Miremadi
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 383 KB
Your tags:
english, 2008
15
Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues
Stéphane Grauby
,
Amine Salhi
,
Luis-David Patino Lopez
,
Wilfrid Claeys
,
Benoît Charlot
,
Stefan Dilhaire
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 747 KB
Your tags:
english, 2008
16
Silicon oxynitride integrated waveguide for on-chip optical interconnects applications
C.K. Wong
,
H. Wong
,
M. Chan
,
Y.T. Chow
,
H.P. Chan
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.20 MB
Your tags:
english, 2008
17
The application of polyimide/silicon nitride dual passivation to AlxGa1−xN/GaN high electron mobility transistors
W.S. Lau
,
S. Gunawan
,
Joy B.H. Tan
,
B.P. Singh
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 661 KB
Your tags:
english, 2008
18
Reservoir effect in SiCN capped copper/SiO2 interconnects
V. Girault
,
F. Terrier
,
D. Ney
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 342 KB
Your tags:
english, 2008
19
Analysis of punch-through breakdown in bulk silicon RF power LDMOS transistors
I. Cortés
,
P. Fernández-Martínez
,
D. Flores
,
S. Hidalgo
,
J. Rebollo
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 812 KB
Your tags:
english, 2008
20
Estimation of warpage and thermal stress of IVHs in flip–chip ball grid arrays package by FEM
Seunghyun Cho
,
Soonjin Cho
,
Joseph Y. Lee
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.43 MB
Your tags:
english, 2008
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