Dynamic void formation in a DD-copper-structure with...

Microelectronics Reliability 2007 Vol. 47; Iss. 2-3

Dynamic void formation in a DD-copper-structure with different metallization geometry

Kirsten Weide-Zaage, David Dalleau, Yves Danto, Helene Fremont
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Volume:
47
Year:
2007
Language:
english
Pages:
7
DOI:
10.1016/j.microrel.2006.09.012
File:
PDF, 1.72 MB
english, 2007
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